Электронная библиотека (репозиторий) Томского государственного университета
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Microstructure and hot deformation behavior of the Cu-1Ni-0.9Sn-0.5Ti-0.3Cr alloy 382 383 2
Improved microstructure, mechanical properties and electrical conductivity of the Cu–Ni–Sn–Ti–Cr alloy due to Ce micro-addition 299 386 93
Enhanced mechanical properties and high electrical conductivity of copper alloy via dual-nanoprecipitation 224 223 1
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Liu, Yong

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